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AM3357 CPU Module, 2mm Pitch, 512MB NAND, 512MB DDR3, Gbit PHY US$93.00

AM3357 CPU Module, 2mm Pitch, 512MB NAND, 512MB DDR3, Gbit PHY

This is the CPU module that is included in the MYD-AM3357 system.

It contains a Texas Instruments AM3357BZCZA80 Sitara 800MHz ARM Cortex-A8 processor, a Gigabit Ethernet PHY, 512MB NAND Flash, and 512MB total DDR SDRAM (2256). The module connects to a main board via two 2mm-pitch 230-pin male headers (CN1 & CN2). It also has pads for further extension headers that you can install optionally: one 2mm-pitch 213-pin header (CN3), and one 2.54mm-pitch 10-pin header (CN4).

The Texas Instruments Sitara AM3357BZCZA80 ARM Cortex-A8 Microprocessor produces high DMIPS at a low cost while also delivering key peripherals. The AM3357 comes with Linux 3.2.0, Android 4.2.2 and Windows CE7 software packages.

The AM3357's Programmable Real-Time Unit and Industrial Communication Subsystem (PRU-ICSS), separate from the ARM core, allows independent operation and clocking for greater efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others.

The connectivity support makes the TI AM3357 MPU ideal for home automation, industrial automation, enterprise/educational tablets, portable navigation devices and networking. Although the CPU has a wider temperature range, this board as a whole is rated for 0 to 70 C. Extended temperature range (-40 to +80 C) is available.

AM3357 CPU Module Features

  • TI AM3357BZCZA80 Sitara 800MHz ARM Cortex-A8 32-bit RISC MPU with NEON SIMD co-processor, 32KB/32KB L1 Instruction Cache, 256KB L2 Cache, Programmable Real-Time Unit Subsystem
  • 512MB DDR3 SDRAM and 512MB Nand Flash
  • Gigabit Ethernet PHY
  • Red Power LED and Green User LED
  • Power Requirements: 3.3V @ 0.8A
  • Dimensions: 70 50 mm
  • 6-layer PCB
  • CPU module connects to main board via two 2mm-pitch 230-pin headers; also provides 2mm-pitch 213-pin and 2.54mm-pitch 110-pin expansion through-hole pads

Interfaces available via the headers include:

  • SPI
  • 2x PWM
  • 3x SDIO
  • 2x USB2.0 OTG ports
  • 6x UART
  • 2x I2C
  • 7x ADC

See below for a complete pinout.

This is one of six CPU modules with the same pinout. You can swap it with the CPU module on a compatible system (i.e. the kits in the right column below) so you can evaluate the different processors in the TI AM335x series. The differences between the six available processors are as follows:

Kit with Base Board
AM3359 MYD-AM3359
AM3358 MYD-AM3358
AM3357 MYD-AM3357
AM3356 MYD-AM3356
AM3354 MYD-AM3354
AM3352 MYD-AM3352

Notes: PRU-ICSS is used for slave industrial communication protocols like PROFIBUS, PROFINET, Powerlink and Ethernet/IP. All boards in this line use the 800MHz version of the respective CPU in 1515/0.8mm ZCZ package, except the AM3358, which uses the 1GHz version. Lead time varies based on CPU! If you need something quickly for development, the AM3358 or AM3352 boards are recommended for the shortest lead time. All boards have the same price regardless of CPU.

AM335x CPU Module Software

Note: The same software package is provided for every board in the MYC-AM335x series. Some drivers and examples may not be supported by certain CPUs.
OS Item Features Description
Linux Bootstrap
SPI Primary bootstrap
u-boot Secondary bootstrap
Kernel Version Linux 3.2.0; gcc compiler 4.7.3
Drivers USB OTG, USB WiFi, Gigabit Ethernet, MMC/SD/TF, NandFlash, CAN, RS485, Audio, LCD Controller (supports 4.3- and 7-inch LCD), RTC, HDMI, Touchscreen (resistive/capacitive), Button, UART, LED
File System UBIFS Image file provided; includes tools such as telnet, ssh, tftp, flash-tools, ubi-utils; includes demos such as GPIO, keypad, UART, RS485, CAN
Android Bootstrap
Bootstrap Used for u-boot
u-boot Secondary bootstrap
Kernel Version Linux 3.2.0; gcc compiler 4.7.3
Drivers USB OTG, Ethernet, SD, Audio, LCD Controller (supports 4.3- and 7-inch LCD), RTC, HDMI, Touchscreen (resistive/capacitive), Button
File System Android 4.2.2 Binary image provided
WinCE Bootstrap
X-loader Primary bootstrap
e-boot Secondary bootstrap
Kernel Version Windows Embedded Compact 7
with OpenGL ES2.0
Drivers USB OTG, Gigabit Ethernet, MMC/SD/TF, NandFlash, I2C, SPI, MCASP, Audio, LCD Controller (supports 4.3- and 7-inch LCD), Touchscreen (resistive/capacitive), Backlight, Battery, RPU, UART, GPIO Keyboard, DMA, LED, CAN
File System BINFS Binary image file provided

AM3357 CPU Module Package Contents

  • MYC-AM3357 CPU Module
  • DVD-ROM with schematic, user manual, BSPs and source code

AM3357 CPU Module Resources

Ships from: China
Lead time: Varies depending on chip availability; see above

Volume discount is available; please contact us.

This product was added to our catalog on Friday 20 June, 2014.


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