This is a bundle of two 204-0019-01 adapter PCBs and the 920-0031-01 solderless breadboard.
Each PCB is a QFP/QFN-to-DIP adapter with a twist. They have the patented Schmartboard|ez technology to make soldering surface-mount devices easy. Your SMT part will sit in grooves that hold it in place and already have solder in them. So all you need to do is put a chip in the grooves, apply flux, and use a small enough soldering tip.
The adapters support 56-pin QFP and QFN devices with 0.5mm pitch (8×8mm body). Each board also includes room for 0805 SMT components (e.g. a bypass capacitor), and pads for easy access to ground. Also, a large plated hole in the center of the device area allows for the addition of solder to utilize ground pads on the bottom of a device.
Four 40-pin male header strips are included. These strips can be snapped apart so that you can create the individual 28-pin segments needed to complete the 56-pin DIP packages.
The Bred Blox solderless breadboard has 830 tie points (126 five-point terminals plus four horizontal bus lines of 50 test points each for easy connections to common lines). The board has interlocking features so that you can connect multiple Bred Blox together to make a larger prototyping area.